Introductions FB chips are constructed from a wire wound structure and has a higher current capacity than multilayer chip beads. It can widely be used in a variety of electronics ,for example : - OA products
- Computer Peripheral devices
- Computer,Notebook
- Cordless Telephones
- VCRs
Features  - High Current Handling
They are able to withstand currents up to 6A DC. - Multiple Size Availability
They are available in three dimensions : 3025 ,4030 and 8530 - Low DC Resistance
They have low DC resistance.Part Number Code
Part Number Code 1).Product Type
2).Dimension (unit : mm) 

3).Packaging 
FB SERIES
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